| |
本文中の略称 | 正式名称 |
AiP | Antenna in Package |
AP | Application Processor |
BB | Baseband Processor |
BBU | Baseband Unit |
BGA | Ball Grid Array |
BMS | Buttery Management System |
CCL | Copper Clad Laminate |
COF | Chip on Film |
COP | Chip on Polyimide |
CoWoS | Chip on Wafer on Substrate |
CPU | Central Processing Unit |
CSP | Chip Size Package |
CTE | Coefficient of Thermal Expansion (熱膨張率) |
Df | Dissipation Factor(誘電正接) |
DI | Direct Imaging(直描) |
Dk | Dielektrizitäts Konstante(誘電率) |
DRAM | Dynamic Random Access Memory |
EV | Electric Vehicle(電気自動車) |
FC | Flip Chip |
FCV | Fuel Cell Vehicle(燃料電池自動車) |
FI-WLP | Fan In Wafer Level Package |
FO-WLP | Fan Out Wafer Level Package |
HBM | High Bandwidth Memory |
HDD | Hard Disk Drive |
HV | Hybrid Vehicle(ハイブリッド車) |
in | inch |
InFO | Integrated Fan Out |
L/S | Line/Space |
MSAP | Modified Semi Additive Process |
MUF | Mold Under Fill(モールドアンダーフィル) |
OLED | Organic Light Emitting Diode(有機EL) |
PCU | Power Control Unit(EV/HEV向けモーター制御ユニット) |
PHV | Plug-in Hybrid Vehicle(プラグインハイブリッド車) |
PI | Polyimide |
PLP | Panel Level Package |
PMIC | Power Management IC |
PoP | Package on Package |
PPE | Polyphenyleneether(ポリフェニレンエーテル) |
Q | 四半期の意味、2021 Q1→2021 年第1 四半期(2021 年1 月~3 月) |
QFN | Quad Flat No-leads Package |
QFP | Quad Flat Package |
RDL | Re Distribution Layer |
SAP | Semi Additive Process |
SiP | System in package |
SLP | Substrate Like PCB |
SoC | System on Chip |
SSD | Solid State Drive |
TSV | Through-Silicon Via |
WLP | Wafer Level Packaging |
WoW | Wafer-on-Wafer |